LT18DP1911

Mfr.Part #
LT18DP1911
Manufacturer
Laird Technologies - Thermal Materials
Package/Case
-
Datasheet
Download
Description
CP,OTH, OCP BP 2.75X7.94X10.50MM
Stock
5022

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Manufacturer :
Laird Technologies - Thermal Materials
Product Category :
RFI and EMI - Contacts, Fingerstock and Gaskets
Attachment Method :
Clip
Height :
0.108" (2.75mm)
Length :
0.398" (10.10mm)
Material :
Beryllium Copper
Operating Temperature :
-
Plating :
Tin
Plating - Thickness :
299.99µin (7.62µm)
Product Status :
Active
Shape :
-
Type :
Fingerstock
Width :
0.276" (7.00mm)
Datasheets
LT18DP1911

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