BMI-C-004-SN

Mfr.Part #
BMI-C-004-SN
Manufacturer
Laird Technologies - Thermal Materials
Package/Case
-
Datasheet
Download
Description
SP CON S SN TNR
Stock
Out of Stock

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Manufacturer :
Laird Technologies - Thermal Materials
Product Category :
RFI and EMI - Contacts, Fingerstock and Gaskets
Attachment Method :
Solder
Height :
0.204" (5.17mm)
Length :
0.235" (5.97mm)
Material :
Beryllium Copper
Operating Temperature :
-
Plating :
Tin
Plating - Thickness :
-
Product Status :
Active
Shape :
-
Type :
Shield Finger
Width :
0.170" (4.32mm)
Datasheets
BMI-C-004-SN

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