0C97054002

Mfr.Part #
0C97054002
Manufacturer
Laird Technologies - Thermal Materials
Package/Case
-
Datasheet
Download
Description
RFI EMI GROUNDING MATERIAL 25FT
Stock
Out of Stock

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Manufacturer :
Laird Technologies - Thermal Materials
Product Category :
RFI and EMI - Contacts, Fingerstock and Gaskets
Attachment Method :
Adhesive
Height :
0.110" (2.79mm)
Length :
16.000" (406.40mm)
Material :
Beryllium Copper
Operating Temperature :
121°C
Plating :
Unplated
Plating - Thickness :
-
Product Status :
Active
Shape :
-
Type :
Fingerstock
Width :
0.280" (7.11mm)
Datasheets
0C97054002

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