WS991SNL35T4
- Mfr.Part #
- WS991SNL35T4
- Manufacturer
- Chip Quik Inc.
- Package/Case
- -
- Datasheet
- Download
- Description
- THERMALLY STABLE SOLDER PASTE WS
- Stock
- 14
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- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Syringe, 1.23 oz (34.869g)
- Melting Point :
- 423°F (217°C)
- Mesh Type :
- 4
- Process :
- -
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 77°F (3°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheets
- WS991SNL35T4
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|---|---|---|---|
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| WS991AX35T4 | Chip Quik Inc. | 0 | THERMALLY STABLE SOLDER PASTE WS |
| WS991AX500T4 | Chip Quik Inc. | 5 | SOLDER PASTE THERMALLY STABLE WS |
| WS991LT35T4 | Chip Quik Inc. | 6 | THERMALLY STABLE SOLDER PASTE WS |
| WS991LT500T4 | Chip Quik Inc. | 6 | SOLDER PASTE THERMALLY STABLE WS |
| WS991SNL500T4 | Chip Quik Inc. | 33 | SOLDER PASTE THERMALLY STABLE WS |
