WS991AX500T4
- Mfr.Part #
- WS991AX500T4
- Manufacturer
- Chip Quik Inc.
- Package/Case
- -
- Datasheet
- Download
- Description
- SOLDER PASTE THERMALLY STABLE WS
- Stock
- 5
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- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Sn63Pb37 (63/37)
- Diameter :
- -
- Flux Type :
- Water Soluble
- Form :
- Jar, 17.64 oz (500g)
- Melting Point :
- 361°F (183°C)
- Mesh Type :
- 4
- Process :
- Leaded
- Product Status :
- Active
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- -
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheets
- WS991AX500T4
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| WS991SNL500T4 | Chip Quik Inc. | 33 | SOLDER PASTE THERMALLY STABLE WS |
