822-AG11D
- Mfr.Part #
- 822-AG11D
- Manufacturer
- TE Application Tooling
- Package/Case
- -
- Datasheet
- Download
- Description
- CONN IC DIP SOCKET 22POS GOLD
- Stock
- 1669
Request A Quote(RFQ)
- * Contact Name:
- * Company:
- * E-Mail:
- * Phone:
- * Comment:
- * Captcha:
-
- Manufacturer :
- TE Application Tooling
- Product Category :
- IC Sockets
- Contact Finish - Mating :
- Gold
- Contact Finish - Post :
- Tin-Lead
- Contact Finish Thickness - Mating :
- 25.0µin (0.63µm)
- Contact Finish Thickness - Post :
- 80.0µin (2.03µm)
- Contact Material - Mating :
- Copper Alloy
- Contact Material - Post :
- Copper Alloy
- Features :
- Open Frame
- Housing Material :
- Polyester
- Mounting Type :
- Through Hole
- Number of Positions or Pins (Grid) :
- 22 (2 x 11)
- Operating Temperature :
- -55°C ~ 105°C
- Pitch - Mating :
- 0.100" (2.54mm)
- Pitch - Post :
- 0.100" (2.54mm)
- Product Status :
- Obsolete
- Termination :
- Solder
- Type :
- DIP, 0.3" (7.62mm) Row Spacing
- Datasheets
- 822-AG11D
Manufacturer related products
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| 822-1452 | LM Technologies Ltd | 0 | MOD SMT HCI 802.11n EUS USB -20c |
| 822-1456 | LM Technologies Ltd | 0 | MOD SMT HCI 802.11n EUS USB -20c |
| 822-1458 | LM Technologies Ltd | 0 | MOD SMT HCI 802.11n EUS USB -20c |
| 822-1459 | LM Technologies Ltd | 0 | MOD SMT HCI 802.11n EUS USB -20c |
| 822-1465 | LM Technologies Ltd | 0 | MOD SMT HCI 802.11n EUS USB -20c |
| 822-4X6 | 3M | 193 | TAPESHEET 822 CLR 4"X6 1=1PAD |
| 822-AG11D-ESL-LF | TE Application Tooling | 0 | CONN IC DIP SOCKET 22POS GOLD |
