DIP050-628-157BLF

Manufacturer :

Amphenol ICC

Product Category :

IC Sockets

Contact Finish - Mating :

Tin

Contact Finish - Post :

Tin

Contact Finish Thickness - Mating :

100.0µin (2.54µm)

Contact Finish Thickness - Post :

200.0µin (5.08µm)

Contact Material - Mating :

Beryllium Copper

Contact Material - Post :

Brass

Features :

Open Frame

Housing Material :

Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled

Mounting Type :

Through Hole

Number of Positions or Pins (Grid) :

28 (2 x 14)

Operating Temperature :

-

Pitch - Mating :

0.100" (2.54mm)

Pitch - Post :

0.100" (2.54mm)

Product Status :

Obsolete

Termination :

Solder

Type :

DIP, 0.6" (15.24mm) Row Spacing