ACC-HS3-SET

Manufacturer :

Enclustra FPGA Solutions

Product Category :

Heat Sinks

Attachment Method :

Bolt On

Diameter :

-

Fin Height :

0.571" (14.50mm)

Length :

2.205" (56.00mm)

Material :

-

Material Finish :

-

Package Cooled :

-

Power Dissipation @ Temperature Rise :

-

Product Status :

Active

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

-

Width :

1.063" (27.00mm)