HS-MA3-R1-SET-R1

Manufacturer :

Enclustra FPGA Solutions

Product Category :

Heat Sinks

Attachment Method :

-

Diameter :

-

Fin Height :

-

Length :

-

Material :

-

Material Finish :

-

Package Cooled :

FPGA

Power Dissipation @ Temperature Rise :

-

Product Status :

Obsolete

Shape :

-

Thermal Resistance @ Forced Air Flow :

-

Thermal Resistance @ Natural :

-

Type :

Top Mount

Width :

-