A14162-24
- Mfr.Part #
- A14162-24
- Manufacturer
- Laird Technologies - Thermal Materials
- Package/Case
- -
- Datasheet
- Download
- Description
- THERM PAD 457.2X457.2MM GRAY
- Stock
- Out of Stock
Request A Quote(RFQ)
- * Contact Name:
- * Company:
- * E-Mail:
- * Phone:
- * Comment:
- * Captcha:
-
- Manufacturer :
- Laird Technologies - Thermal Materials
- Product Category :
- Pads, Sheets
- Adhesive :
- Tacky - Both Sides
- Backing, Carrier :
- -
- Color :
- Gray
- Material :
- Silicone Elastomer
- Outline :
- 457.20mm x 457.20mm
- Product Status :
- Obsolete
- Shape :
- Square
- Thermal Conductivity :
- 1.1W/m-K
- Thermal Resistivity :
- -
- Thickness :
- 0.0400" (1.016mm)
- Type :
- Gap Filler Pad, Sheet
- Usage :
- -
- Datasheets
- A14162-24
Manufacturer related products
Catalog related products
Related products
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| A14100A-1BG313C | Microsemi Corporation | 0 | IC FPGA 228 I/O 313BGA |
| A14100A-1CQ256B | Microsemi Corporation | 0 | IC FPGA 228 I/O 256CQFP |
| A14100A-1CQ256C | Microsemi Corporation | 0 | IC FPGA 228 I/O 256CQFP |
| A14100A-1CQ256M | Microsemi Corporation | 0 | IC FPGA 228 I/O 256CQFP |
| A14100A-1PG257B | Microsemi Corporation | 0 | IC FPGA 228 I/O 257CPGA |
| A14100A-1PG257C | Microsemi Corporation | 0 | IC FPGA 228 I/O 257CPGA |
| A14100A-1PG257M | Microsemi Corporation | 0 | IC FPGA 228 I/O 257CPGA |
| A14100A-1RQ208C | Microsemi Corporation | 0 | IC FPGA 175 I/O 208RQFP |
| A14100A-1RQ208I | Microsemi Corporation | 0 | IC FPGA 175 I/O 208RQFP |
| A14100A-BG313C | Microsemi Corporation | 0 | IC FPGA 228 I/O 313BGA |
| A14100A-CQ256B | Microsemi Corporation | 0 | IC FPGA 228 I/O 256CQFP |
| A14100A-CQ256C | Microsemi Corporation | 0 | IC FPGA 228 I/O 256CQFP |
| A14100A-CQ256M | Microsemi Corporation | 0 | IC FPGA 228 I/O 256CQFP |
| A14100A-PG257B | Microsemi Corporation | 0 | IC FPGA 228 I/O 257CPGA |
| A14100A-PG257C | Microsemi Corporation | 0 | IC FPGA 228 I/O 257CPGA |
