| 5770 |
3M |
0 |
LOW OUTGASSING LABEL MATERIAL |
| 5770 |
Pomona Electronics |
0 |
TEST CLIP QFP 208 (4 X 52) |
| 577002B00000G |
Aavid, Thermal Division of Boyd Corporation |
12,675 |
HEAT SINK TO-220 .250" COMPACT |
| 577002B04000G |
Aavid, Thermal Division of Boyd Corporation |
1,409 |
HEATSINK TO-220 W/TAB .25 |
| 577050012 |
Amphenol ICC |
0 |
CONN CABLE IDC |
| 577064016 |
Amphenol ICC |
0 |
CONN CABLE IDC |
| 577064017 |
Amphenol ICC |
0 |
CONN CABLE IDC |
| 577064018398448 |
Amphenol ICC |
0 |
CONN CABLE IDC |
| 577093-001 |
Interlight |
0 |
Replacement for Hp Hewlett Packa |
| 5770EEG1W00095 |
Laird Technologies - Thermal Materials |
0 |
IO NICU CF V0 |
| 5770L |
Pomona Electronics |
0 |
TEST CLIP QFP 208 (4 X 52) |
| 5770N |
Interlight |
11 |
Replacement for Wai Global 5770N |
| 5770NF 55.5'X1668' |
3M |
0 |
3M LOW-OUTGASSING REMOVABLE LABE |
